Shenzhen Goldlink Tongda electronics Co,.Ltd

Контактная информация

Shenzhen Goldlink Tongda electronics Co,.Ltd

Для того, чтобы связаться с поставщиком, необходимо авторизоваться или пройти регистрацию

Отправить запрос поставщику

GLPOLYis a leading enterprise in the field of thermal conductive materials and thermal management solutions.At Goldlink, developing high quality thermal interface materials and thermal solutions for the electronics industry is our top priority.

We serve a wide range of industries worldwide, including automotive, computing, 5G telecommunications, consumer electronics, LED lighting, solar, military and power conversion..We pride ourselves on fast sampling, an extensive product portfolio and best-in-class technical support.

As a professional manufacturer of thermal interface materials, we understand the issues and we know that there is always a better way to help you achieve your goals and objectives.

GLPOLY focuses on a single purpose - discovering needs, then developing and delivering advanced thermal solutions through dedication and innovation.


Товары:

Shenzhen Goldlink Tongda electronics Co,.Ltd
Shenzhen Goldlink Tongda electronics Co,.Ltd GLPOLYis a leading enterprise in the field of thermal conductive materials and thermal management solutions.At Goldlink, developing high quality t...
XK-P20 and series
XK-P20 and series Features Conformable, low hardness Excellent compressible Good electrical insualtion Low strain for delicate components Applicat...
XK-P30
XK-P30 Features High thermalperformance Conformable, low hardness Excellent compressible Good electrical insualtion Low strain for delicate components ...
XK-P45
XK-P45 Features High thermal conductivity 4.5W/mK Conformable, low hardness Good electrical insulation Applications Automotive electronics Digital...
XK-P50
XK-P50 Features High performance Low thermal impedance Good electrical insualtion Easy assembling Applications Automotive electronics Digital disk ...
XK-P60
XK-P60 Features Thermal conductivity 6.0W/mK Low thermal impedance Good electrical insualtion Easeofhandling Applications Automotive electronics Di...
XK-P110
XK-P110 Features Thermal conductivity 11.0W/mK Low thermal impedance Good electrical insualtion Ease ofhandling Applications Automotive electronics...
XK-P110
XK-P110 Features Thermal conductivity 11.0W/mK Low thermal impedance Good electrical insualtion Ease ofhandling Applications Automotive electronics...
XK-P80
XK-P80 Features High thermal conductivity 8.0W/mK Low thermal impedance Good electrical insualtion Ease ofhandling Applications Automotive electroni...
XK-S20
XK-S20 Features Thermal conductivity 2.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1...
XK-S20
XK-S20 Features Thermal conductivity 2.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1...
XK-S40
XK-S40 Features Thermal conductivity 4.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1...
XK-S30
XK-S30 Features Thermal conductivity 3.0W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1...
XK-S25
XK-S25 Features High performance Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1:1, no cure ...
XK-S15
XK-S15 Features Thermal conductivity 1.5W/mK Conforming, ideal for delicate conponent and low stress applications Cure at room or elevated temperature 1...
XK-G32
XK-G32 Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applica...
XK-G80
XK-G80 Features Thermalconductivity8.0W/mK Wetoutsurface,nopumpout Lowcompressionforce Conformingwithwetout Ultralowstressoncomponent Applications A...
XK-G60
XK-G60 Features Thermalconductivity6.0W/mK Lowthermalimpedance Ultralowcompressionforce Long-termreliability Designforlowstressapplication Applicatio...
XK-G50
XK-G50 Features Thermal conductivity 5.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application App...
XK-G40
XK-G40 Features Thermal conductivity 4.0W/mK Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application App...
XK-G20
XK-G20 Features High thermal performance Low thermal resistance Ultra thin bondline Conforming with wet out Design for low stress application Applic...
XK-D20L
XK-D20L Features Thermalconductivity2.0W/(m.K),lowstress Excellentelectricalinsulation,bondingstrength≥13Mpa Applicationtemperature:-45~175℃,Shortterm...
XK-D12
XK-D12 Features Fillinggapsbetweenheatsourceandheatsink Excellentelectricalinsulation,bondstrength≥13Mpa Applicationtemperature:-45~175℃,Shortterm:25...
XK-D30
XK-D30 Features Thermalconductivity3.0W/(m.K),flammabilityUL94-V0 Excellentelectricalinsulation,bondingstrength≥13Mpa Applicationtemperature:-45~123℃...
PCM XK-C16
PCM XK-C16 Features High performance Low thermal impedance Can be applied at room temperature Wet out and resists dripping after phase change Good electrical ...
XK-GN30
XK-GN30 Features High thermal performance Low thermal resistance Ultra conforming Low stress, non pump-out Applications Automotive electronics Coms...