Wafer Back Grinding Wheel

• 

E-Grind Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. E-Grind Wafer Back Grinding Wheel use a special vitrified bond for rough grinding or a resin bond for fine finishing and improved process accuracy. Our wafer grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.

Performance of Wafer Back Grinding Wheel
Leading technology
Good self-sharpening
No dressing required
High yeild rate of work-piece

Applications of Wafer Back Grinding Wheel
E-Grind wafer back grinding wheel serves various crucial applications in the LED and Semiconductor industries, primarily focusing on the back thinning process of wafers. The use of wafer back grinding wheel contributes to the production of high-performance semiconductor devices, microelectronics, and LED components, while also improving yield and cost efficiency in the manufacturing process.

Semiconductor Device Manufacturing:

Wafer back grinding wheels are extensively employed in the semiconductor industry for the manufacturing of integrated circuits (ICs) and other semiconductor devices. These wheels play a vital role in the thinning of semiconductor wafers, a critical step in the production of high-performance electronic components.

LED (Light-Emitting Diode) Production:
In the LED industry, wafer back grinding wheels are utilized for back thinning processes during the production of LED wafers. This is essential for achieving the desired thickness of the wafer while maintaining precision, as it impacts the optical and electrical properties of the final LED devices.

Microelectronics Manufacturing:
The precision and efficiency of wafer back grinding wheels make them indispensable in the production of microelectronic components. These components are integral to various electronic devices, including smarts, tablets, and other consumer electronics.

E grind, as an excellent cbn grinding wheel suppliers, offers a wide range of metal bonded diamond grinding wheels for you to choose from.

Other supplier products

	Internal Grinding Wheel	Internal Grinding Abrasives E-Grind Vitrified CBN internal grinding wheels are widely used for grooving of vane pump rotors and synchromesh ball j...
	Dicing Blades Without Hub	The wafer dicing bladewithout hub is a kind of ultra-thin and precision diamond dicing bladeswith excellent cutting ability, good rigidity, and hig...
	Diamond Dressing Roller	Vitrified grinding wheels with Silicon Carbide, Aluminum Oxide, Diamond, or CBN as grinding media lose their profile accuracy and cutting capacity ...
	Metal Bond Grinding Wheels	Metal bonded diamond grinding wheels from Henan E-Grind Abrasives Co., Ltd. can function in a variety of wet or dry situations. Here at Henan E-Gri...
	Electroplated Tools	Henan E-Grind Abrasives Co., Ltd. produces electroplated tools by plating diamond or CBN grains with a single layer of nickel. These electroplated ...

Same products

	Diamond Grinding Wheel Dresser	Seller: Henan E-Grind Abrasives Co., Ltd.	E-Grind developed abrasive wheel dresser widely used in many metalwork industries like auto parts...
	Centerless Grinding Wheels	Seller: Henan E-Grind Abrasives Co., Ltd.	E-Grind Centerless wheels are widely used for grinding TCT cutting tools, bearing parts, automobi...
	Diamond And CBN Grinding Wheels	Seller: Henan E-Grind Abrasives Co., Ltd.	As one of the reputable cbn grinding wheel manufacturers, Egrindprovides different types of abr...
	Double Disc Grinding Wheels	Seller: Henan E-Grind Abrasives Co., Ltd.	Vitrified bond Diamond/CBN double disc performs grinding and lapping in one process using a fixed...
	Grinding Wheel Dressing Stick	Seller: Henan E-Grind Abrasives Co., Ltd.	Abrasives Dressing Stick E-Grind supply grinding wheel dressing sticks to help you achieve maxim...